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Wafer Sawing
Our fully automated sawing machine is able to meet customer need in wafer dicing. The machine with build in wafer washer will minimize silicon dust contamination and reduce wafer handing.
Capability
- Wafer Size up to 8 inch wafer
- Minimum Wafer Thickness of 8 mils
- Partial Cut and Cut through option
- Pattern Recognition System with Grey level recognition
- 2 channel sawing
- Saw Speed up to 3 feet per minute
- Saw street will be depending on Sawing blade thickness
- Auto-washer together with the Sawing Machine