Packaging Services
We can build your product in a standard, off-the-shelf package or help with a completely custom designed package. Whatever your packaging needs, DSEM is ready to work for you.
Standard Package Offerings
- Small Outline, Gull-Wing leaded (SOIC) 150 mils body width
- Small Outline, Gull-Wing leaded (SOIC) 300 mils body width
- Thin Shrink Small Outline, Gull-wing Leads (TSSOP) 4.4 mm body width
- Dual In Line Package (PDIP) 300 mils body width
- Dual In Line Package (PDIP) 600 mils body width
Capability
- Current assembly equipment cater for up to 6 inch wafer with minimum of 11mils (279micron) thickness.
- Capable of running fine pitch package of 3.9 mils (14.8micron).
- Gold wire bonding with 1.5 mils diameter.