DSEM

CSAM

Our C-SAM machine is a high speed acoustic micro-imaging system which can be used for failure analysis or part screening. The system can be used to screen parts to MIL-STD-883, Method 1034, and JEDEC standard J-STD-035 (Acoustic Microscopy of Non-Hermetics).

The system uses a pulsed, high-frequency sound signal which is transmitted and received by a transducer. The return signal produces a layer-by-layer image based on differences in acoustical impedance at material interfaces. Images can be displayed in 2 or 3 dimensions. The system is very adept at revealing cracks and areas of delamination and has been used extensively for detecting "popcorn separations" in plastic devices. The machine can also be used to calculate the percent voiding for die attach and solder seal which eliminates the subjective measurement of these by methods such as x-ray. The output is vedersatile and allows color printing of images or electronic file capture.