HI-TECH SOLUTIONS BACKED BY WORLD CLASS SERVICE
Your packaging options
Whatever your requirements, we have the ideal solution for you - whether in one of standardized designs, or a custom-made design tailored to meet your special needs. Learn more.
An array of burn-in services
We have developed a new design concept which separates the driver board from the burn-in board. Learn more.
Inspection on a microscopic level
We use a CSAM machine to test for failure analysis and part screening. The machine is a high speed acoustic micro-imaging system which can reveal cracks, areas of delamination, detecting 'popcorn separations' and calculate the percent voiding for die attach and solder seal. Learn more.
Precision placement
We provide support tape and reel services to meet your specific semiconductor and other surface mount device needs. Learn more.
It dices, it slices!
We have a fully automated sawing machine for wafer dicing. The machine has a build-in wafer washer which will minimize silicon dust contamination. Learn more.
Make your mark
Our laser marking system burns in permanent marks on IC packages according to your unique marking format. Learn more.