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Advanced Metal Substrate (AMS)


DSEM’s Advanced Metal Substrate (AMS) is a unique multilayer substrate technology developed for microelectronics packaging applications. Protected by several patents, AMS requires no drilling or plating – the via is of solid aluminium and the dielectric is of a high quality ceramic nature.

 
AMS technology serves as a wide technology platform, which can be implemented in various electronics packaging applications such as for RF, SiP, 3-D memory stacks, MEMS and high power modules and components. The technology’s clear advantage over its competition – in both laminate/build-up substrate or ceramic based – is in its technical performance and cost.

AMS’ main technical advantages include:  

  • Superior thermal properties due to embedded integral aluminium heat-sink option.
  • High speed, due to the special vias built of full aluminium of very low inductance.
  • Very high routing density - metal layers having copper signal layers of <1/1 mil line/space.
  • Option for building special features needed for RF applications, strip lines, wave guide structures and controlled impedance lines.
  • Easy option for including integrated passives such as resistors in the multilayer.


Production costs are significantly lower relative to competitive PCB-type substrate technologies, mainly due to lack of the drilling and hole plating processes.

While making its AMS technology available to the market, DSEM currently utilises AMS in the production of its High-Power Light Emitting Diodes (LEDs). Today, as technological advancements in LED design and processes are continually boosting light output to rival incandescent, fluorescent, and even halogen light sources, the need to protect the LEDs against heat build-up is greater than ever before.
 

For detailed information on AMS, please see our Technology or download our Datasheet.