Wafer Sawing

Wafer Sawing

WAFER SAWING

Our fully automated sawing machine is able to meet customer need in wafer dicing. The machine with build in wafer washer will minimize silicon dust contamination and reduce wafer handing.

Capability

Wafer Size up to 8 inch wafer
Minimum Wafer Thickness of 8 mils
Partial Cut and Cut through option
Pattern Recognition System with Grey level recognition
2 channel sawing
Saw Speed up to 3 feet per minute
Saw street will be depending on Sawing blade thickness
Auto-washer together with the Sawing Machine