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TAPE & REEL

 

We can provide complete tape and reel services for your semiconductor and other surface mount device needs. We can obtain other customer specific materials at your request and used latest technology in automatic tape & reel equipment for precision placement and quality results.

 

Capability

  • Current equipment cater for SOIC(N), SOIC(W), TSSOP 4.4mm & MLP/QFN.
  • Equipment UPH of 6,000 with Vision for 3D Lead and Marking inspection.
  • Equipment caters any Carrier and Cover Tape using Pressure Seal and Heat Seal.