Home Services Packaging Services
PACKAGING SERVICES

 

We can build your product in a standard, off-the-shelf package or help with a completely custom designed package. Whatever your packaging needs, DSEM is ready to work for you.

 

 

 

Standard Package Offerings

  • Small Outline, Gull-Wing leaded (SOIC) 150 mils body width
  • Small Outline, Gull-Wing leaded (SOIC) 300 mils body width
  • Thin Shrink Small Outline, Gull-wing Leads (TSSOP) 4.4 mm body width
  • Dual In Line Package (PDIP) 300 mils body width
  • Dual In Line Package (PDIP) 600 mils body width


 

Capability

  • Current assembly equipment cater for up to 6 inch wafer with minimum of 11mils (279micron) thickness.
  • Capable of running fine pitch package of 3.9 mils (14.8micron).
  • Gold wire bonding with 1.5 mils diameter.