DSEM

ALOX™ is a unique multilayer substrate technology developed for microelectronics packaging applications.

The technology is protected by several patents.

In ALOX™, no via drill and plating is required - the via is of solid full aluminium and the dielectric is of a high quality ceramic nature. The process is simple and low cost, and contains a low number of process steps.

The ALOX™ technology serves as a wide technology platform, and can be implemented in various electronics packaging applications such as for RF, SiP, 3-D memory stacks, MEMS and high power modules and components.

The advantages of ALOX™ substrates over the competition - either laminate/build-up substrate based or ceramic based - are both in technical performance and in cost.

Main technical advantages:

• Superior thermal properties, due to embedded integral aluminium heat-sink option: ceramic matrix, very thin, low profile.
• High speed, due to the special vias built of full aluminium of very low inductance.
• Very high routing density - metal layers having copper signal layers of <1/1 mil line/space.
• Option for building special features needed for RF applications, strip lines, wave guide structures and controlled impedance lines.
• Easy option for including integrated passives such as resistors in the multilayer.

Cost advantages:

• Production costs are significantly lower relative to competitive PCB-type substrate technologies, mainly due to lack of the drilling and hole plating processes.
• Basically, ALOX™ provides a ceramic-based substrate, fabricated by a minimal number of steps of PCB-like processes and manufacturing techniques.